TEC Products are divided  to series and define by symbols and parameters options

PRODUCT SERIES Available : S, SN, R, C, CH, D, DH, H
Parameters:

“S” - SERIES, “STANDARD”

High performance modules for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operation temperature: up to 120°С

•• Max ΔT up to 75°С (at Thot=25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Wires: UL-1569 in PVC insulation

“R” - SERIES, “RELIANCE”

High performance for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature for short time (to mount a module into unit): 120°С

•• Recommended operating temperature: up to 90°С

•• Max ΔT: up to 75°С (at Thot= 25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: over 25 000 cycles

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Wires: UL-1569 in PVC insulation

“C” - SERIES, “CYCLE”

Modules, designed for applications that imply long-term cycling stability with the change of polarity of electric current (lasers, thermal stabilization device test stands chip production, etc.).

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operating temperature: up to 120°С

•• Recommended operation current: 0.7 of Imax.

•• Max ΔT: up to 75K (at Thot= 25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: up to 25 000 cycles

“H” – SERIES, “HOT”

Modules, designed for applications requiring high efficiency unit at operating temperature, not exceeding 150 °C. Possible to use in the long-term heating mode.

•• Maximum temperature for short time (to mount a module into unit): 200 °С

•• Recommended operation temperature: up to 150 °С

•• Max ΔT up to 75K (at Thot=25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Modules of this series pass additional annealing at 150°С

•• Recommended operation current: 0.7 of Imax

“D” - SERIES, HIGH POWER DENSITY MODULES (“HPDM”)

Modules, designed for applications requiring high performance modules where the devices (lasers, thermal stabilization of test bench device for chip production, etc.) produce a large amount of heat that needs to be removed constantly or in a short time.

•• Maximum temperature for short time (to mount a module into unit): 130°С

•• Recommended operating temperature: up to 120 °С

•• Recommended operation current: 0.5 – 0.7 of Imax.

•• Minimal cycling stability in ON-OFF power mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: up to 25 000 cycles

•• Recommended operating temperature not higher than 90 °С

•• At operating current (I) close to 0,5 from Imax these modules provide COP, close to 1.

“SN” - SERIES, “STANDARD - 232”

High performance modules for traditional cooling applications (refrigeration, electronics, industrial, automotive)

•• Maximum temperature to mount a module into unit: 180 °С

•• Recommended operation temperature: up to 120 °С

•• Max ΔT up to 75°С (at Thot =25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Recommended operation current: 0.7 of Imax

•• Recommended operation voltage: 0.8 of Umax

•• Series is assembled on solder with melting point 232 °С

“CH” - SERIES, “CYCLE + HOT”

Modules, designed for applications that imply long-term cycling stability with the change of polarity of electric current. (lasers, thermal stabilization of test bench device for chip production, etc.).

•• Maximum temperature to mount a module into unit: 200 °С

•• Recommended operating temperature: up to 150°С

•• Recommended operation current: 0.7 of Imax.

•• Max ΔT: up to 75K (at Thot= 25 °С)

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: up to 25 000 cycles

“DH” - SERIES, HIGH POWER DENSITY MODULES, “HPDM + HOT"

Modules, designed for applications requiring high performance modules where the devices (lasers, thermal stabilization of test bench device for chip production, etc.) produce a large amount of heat per square.

•• Maximum temperature for short time (to mount a module into unit): 200°С

•• Maximum operation temperature: 150°С

•• Recommended operation current: 0.5 – 0.7 of Imax.

•• Minimal cycling stability in ON-OFF power cycling mode: over 60 000 cycles (cycle time is 60/60 seconds)

•• Minimal cycling stability in 20/80 °С power cycling mode: over 25 000 cycles

OPTIONS FOR SURFACE FINISH:

L1 – height tolerance ± 0.01 mm

L2 – height tolerance ± 0.02 mm

R – round shape of the module

H – module has a circular hole in the ceramics

Mch – both sides have metallization (height tolerance ±0.15)

Mc – only cold side has metallization (height tolerance ±0.15)

Mh – only hot side has metallization (height tolerance ±0.15)

TchX – both sides have tinning, height tolerance before tinning ±0.15

TcX – only cold side has tinning, height tolerance before tinning ±0.15

ThX – only hot side has tinning, height tolerance before tinning ±0.15

X – type of solder used for tinning: 1 – solder with melting temperature 117 °С ,

2 – solder with melting temperature 138 °С.

No code – module is not lapped, without metallization or tinning

SEALING TYPE

The  reliability of thermoelectric modules (TEMs) can be degraded  when moisture or vapor is being condense within the device. This causes corrosion in the TEM and eventually leads to  failure.  There are two main common sealing:

S – silicon sealing;  (preferable in cycling applications)
E – epoxy sealing;  ( very strong, more brittle  and has better moisture prevention capability to enter the TEM)

Absence of sealing index means modules without sealing.
​
I-  Operating current of the TEC module in Amps

I - max Maximum operating Current that results in maximum temperature difference dT

Qc - Amount of heat that can be observed at the cooling side of the TEC (in watts)

Q max -The maximum amount of heat at the cold side when I - I max and Delta T =0

Thot - Temperature at the hot side of the TEC  during operation

Tcold -Temperature at the cold side of the TEC during operation

Delta T  The difference in temperature between hot and cold Sides

Delta T max The Maximum difference in temperature between hot and cold Sides at I max

U max Voltage supply at I max

Epsilon TEC cooling efficiency in %

Alpha Seeback coefficient  the TEC in Voltage/Celsius

K Thermal conductivity (w/cm*c)

N  Number of Thermoelctric elements

NOTE! MAX ΔT IS REDUCED BY 2-3°С FOR SILICONE AND BY 1-2°С FOR EPOXY SEALING VERSIONS.

THE MODULES CAN BE ASSEMBLED IN KITS WITH SERIES OR PARALLEL CONNECTION OR INSTALLED IN A DEVICE FOLLOWING CUSTOMER’S DESIGN & CONSTRUCTION DOCUMENTATION