We offer development services using new type of thermoelectric modules including multistage and micro modules.
- Compact liquid heat exchangers made of aluminum and copper.
- High-performance thermoelectric assemblies (air-air, contact-air, liquid-air)
Our custom Thermal solutions utilize three major technology heat removal options:
1. Thermal Electrical Cooler based on Paltier elements using Liquid cooling (Process Control Water or Ethylene Glikol) Pic1.
2. Phase change system using Refrigerant cooling cycle (no liquid water is needed ) Pic 2.
3. Climate Bench top Mini Chambers to cool/heat full using air flow inside the chamber PCBs. Pic3
Custom made Liquid cooling for Silicon Thermal Validation -40c to 125 c (pic 1)
Phase change for Si temp’ forcing system -40c to 120c (pic 2)
Desk Top Mini climate chamber temperature forcing system for PCB testing during operation ( pic 3)